Aeva is building the next generation of sensing and perception for autonomous vehicles and beyond. With its unique ability to measure instantaneous velocity for each pixel, and long-range performance at high resolutions, while being free from LiDAR or sunlight interference, Aeva’s 4D LiDAR is built from the ground up at silicon photonics scale for mass-market applications.

Role Overview:

Lead and own both bare die and chip-on carrier assemblies based on III/V edge-emitting lasers and optical amplifiers.

What you'll be doing:

Responsible for driving performance and yield improvement experiments through external foundries
Work with cross-functional teams, both external and internal, to drive improvement plans, assist in FA activities, and contribute to design reviews
Drive scalability and manufacturability projects so that the products can scale with increasing volume
Drive resolution of product manufacturing issues (Epi, wafer process, and coating) at external foundries

What you have:

5+ years of experience with edge-emitting laser or VCSEL product engineering
Comfortable with analyzing large datasets using JMP/R/Python
Demonstrated experience with characterization and testing of edge-emitting lasers
Can-do attitude with a zeal to solve complex problems in a cross-functional product development environment
Experience with working in a fast-paced, agile environment

Nice to haves:

Experience with one of the MOCVD/III-V wafer process/ III-V backend process
Prior Experience with solving laser-quality issues in a QRE/Applications Engineering role