In This Role, You Will

Lead the SI/PI architecture and define constraints for next-generation, high-complexity, high-density printed circuit boards (PCBs) and overall system design.
Collaborate at an architectural level with hardware design, silicon vendors, PCB layout, and mechanical engineering teams to define layer stack-ups, routing strategies, component placement, and power delivery architectures.
Analyze, optimize, and sign off on advanced high-speed serial links (PCIe, Ethernet, MIPI, GMSL) and memory interfaces (LPDDR).
Provide expert-level design guidance and validation for automotive-specific communication and audio protocols (A2B).
Architect and conduct comprehensive Power Delivery Network (PDN) analysis, including DC IR drop, AC impedance modeling, and transient response analysis to ensure stable power delivery across complex multi-board systems.
Drive the development of advanced SI/PI routing rules, simulation methodologies, automation scripts, and sign-off processes for the hardware engineering department.
Tackle the most complex, unprecedented signal and power integrity challenges, performing hands-on root-cause analysis, lab measurements, and correlating simulation models with real-world testing.
Act as a technical mentor and subject matter expert, elevating the SI/PI capabilities of the entire hardware organization and guiding junior to senior engineers.

Qualifications

Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Computer Engineering, Physics, or a closely related technical field.
10+ years of proven industry experience in signal and power integrity analysis for complex high-speed digital designs.
Extensive, proven track record designing, simulating, and troubleshooting high-speed interfaces, specifically PCIe, multi-gigabit Ethernet, MIPI (CSI/DSI), and GMSL, through multiple successful product lifecycles.
Deep expertise in memory interface design and simulation, with a strong focus on advanced LPDDR technologies.
Familiarity with automotive audio and sensor bus protocols, such as A2B.
Advanced proficiency with industry-standard 2D/3D electromagnetic extraction and SI/PI simulation tools (e.g., Ansys HFSS/SIwave, Keysight ADS, Cadence Sigrity, or Siemens EDA/HyperLynx).
Mastery of electromagnetics, transmission line theory, cross-talk, jitter, and advanced PDN design principles.
Expert-level hands-on experience with high-speed lab characterization equipment, including Vector Network Analyzers (VNAs), Time-Domain Reflectometers (TDRs), and high-bandwidth oscilloscopes.

Bonus Qualifications

Direct experience in the automotive industry, particularly developing hardware for advanced driver-assistance systems (ADAS) or autonomous vehicles.
Deep understanding of automotive reliability standards, compliance requirements, and designing for harsh environmental operating conditions.
Extensive experience with high-layer-count HDI (High-Density Interconnect) PCB design, advanced packaging, and pushing the boundaries of modern fabrication capabilities.
Proven ability to influence technical strategy, drive cross-functional alignment, and clearly communicate complex technical trade-offs to executive and non-SI/PI stakeholders.

259000 - 311000 USD a year